BINTAN 200MW
04 / Technology Cooling · B300 Service Rev B

Cold plates on the chip. Nothing else matters.

Direct-to-chip liquid cooling at rack level, with the GB300 NVL72 reference architecture validated before your cluster arrives. The cooling circuit is closed, the water is ours, and the cold plates are already mounted on the dies.

Liquid cooling

Click a part

Cold plates on the chip, CDU heat exchangers, dry coolers at the perimeter. Every stage is redundant and maintainable without dropping the load.

DRY COOLER NO EVAPORATION 4 CDU A / B 1.2 MW PER UNIT 1.2 MW PER UNIT 8 PER MODULE 1 RACK BANK · 32 x GB300 NVL72 COLD PLATES ON THE CHIP · 136 kW PER RACK 2 AIR WALL · N+2 12 x 120 kW · 1.8 m CONTAINMENT · CEILING RETURN 3 FILTRATION ISA 71.04 G1 +5 Pa POSITIVE 5 CLOSED PRIMARY LOOP · NEVER LEAVES THE HALL · NO MAKE-UP WATER 800 V DC BUSWAY FROM SST · 800 A · 4N3 REDUNDANT 24 m MODULE LENGTH · 13 m DEPTH · 312 m² FLOOR HOT AISLE 1.8 m BLUEPRINT · LIQUID COOLING CIRCUIT · 32 RACK MODULE · SCALE 1:50
Select a part

Rack bank

Click any component on the cooling diagram above to see its specification.

45°C Supply temp

Warm water loop, high delta-T, efficient heat rejection.

136kW Per rack

GB300 NVL72 with cold plates on every die.

< 1% PUE

Liquid cooling eliminates chillers and CRACs.

0L Make-up water

Closed loop, zero consumption beyond evaporation loss.

Cold plate

Direct contact on GPU, HBM, and power MOSFETs. Copper micro-fin channels, quick-disconnect fittings with dripless mating. Leak detection at every junction.

CDU

N+1 redundant CDUs, A and B loops. 1.2 MW per unit, 8 per module. Solid-state pumps, variable speed, pressure-compensated flow.

Heat rejection

Dry coolers at the perimeter. Warm water (45°C supply, 50°C return) rejects heat to ambient air. No chillers, no compressors.

Containment

Hot aisle sealed, ceiling return. Cold aisles open. Positive pressure in the hall, ISA 71.04 G1 corrosion rating.

GB300 NVL72 Service

The rack is validated before your cluster arrives

ASSEMBLED ENVELOPE · 2.1 m TALL 800 V DC TAP / PDU 01 · 800 A 4N3 BUSWAY 800 V FROM SST POWER SHELF 02 · 5 x POWER SHELF 800 V DC TO GPU RAIL QUANTUM-X800 IB 03 · 12 SWITCHES 1:1 FAT TREE, 800 G 72 GPUs · COLD PLATES ON DIE 04 · COMPUTE SLEDS NVL72 · 136 kW SUPPLY / RETURN MANIFOLD 05 · SLOW-LOOP MANIFOLD 45 °C IN · 2N CDU 06 · RISER + BASE ≥ 20 kN/m² SLAB 600 kW PIPE RESERVED · KYBER
Select a stage

800 V DC tap and rack PDU

Click any stage on the rack diagram above to see its specification.

H200GB300 NVL72Rubin VR200Kyber
GB300 NVL72
136kW Per rack
80% Heat to liquid
45 °C Supply temp
1,471 Racks for 200 MW
Reference architecture

72 GPUs per rack, cold plates mounted on the die, 136 kW per rack. The rack is assembled, tested, and validated before your cluster arrives. You bring the servers, we provide the rack and the power.

Service model

Choose turnkey delivery with the rack already commissioned, or pick up at white-floor and let your team do the fit-out. Either way, the reference architecture is DSX-validated and Tier III concurrent maintainable.

Compatibility

Beyond B300

GPU compatibility — GB300 NVL72, B200, H100/H800 with adapter cold plates. Custom sleds for non-NVIDIA accelerators.

Network — Quantum-X800 NDR InfiniBand, 400 GbE. Spine-leaf topology, oversubscription ratios configurable.

Cooling — 45°C supply, 50°C return. Compatible with all major CDU manufacturers.

Power — 800 V DC busway, 800 A per rack. PDU shelves drop to 48 V DC at the rack.

Rack envelope — 2.1 m tall, 1.2 m wide, 1.2 m deep. Fits standard raised floor or slab-mount.

Commissioning — Factory acceptance test, site acceptance test, burn-in cycle, warm handover.